基于CMOS平台的硅光子关键器件与工艺研究

发布时间:2018-09-18 作者:赵瑛璇,武爱民,甘甫烷

[摘要] 面向互补金属氧化物半导体(CMOS)工艺兼容的硅基光互连体系,研制了包括光波导、光栅耦合器、刻蚀衍射光栅、偏振旋转分束器、光频梳以及3D互连新器件等的硅光子关键器件,并对相应器件的设计及工艺给出了最新的研究结果。基于以上关键硅光子器件进行了大规模光子集成,实现了片上集成的微波任意波形发生器,并集成了300多个光器件,包括高速调制、延迟线和热调等功能。面向数据通信研制了八通道偏振不敏感波分复用(WDM)接收器,解决了集成系统中的偏振敏感问题。

[关键词] 硅光子技术;硅基光互连;大规模光子集成

[Abstract] The core components for silicon-based optical interconnection system compatible with complementary metal oxide semiconductor (CMOS) platform is developed, including optical waveguides, grating couplers, etched diffraction gratings, polarization rotator-splitters, optical combs, and new devices for 3D optical interconnections. Based on the key silicon photonic devices, a large-scale photonic integration has been carried out to realize the on-chip integrated microwave arbitrary waveform generator, and more than 300 optical devices, including high-speed modulation, delay line and thermal modulation functions, have been integrated. An 8-channel polarization insensitive wavelength division multiplexing (WDM) receiver for data communication is developed, which solves the polarization sensitivity problem in integrated system.

[Keywords] silicon photonics technology; optical interconnections; large-scale photonics integration

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