高速光器件封装技术发展趋势

[摘要] 针对5G应用场景，高速光模块起着重要的作用，其设计、制备和封装受多方面的因素限制。就封装这一因素对光模块高频特性的影响进行了详细分析，并提出了3种不同维度的设计方案。基于此，针对性地开发了3种符合应用标准的高速光模块。认为在未来大规模、高密度、高速率光电集成器件中，封装技术将会朝着多维度、多形态的方向发展。

[关键词] 三维封装；高速直调激光器；单片集成外调激光器；多波长激光器

[Abstract] High-speed optical module plays an important role in 5G application scene, and its design, fabrication and packaging are affected by many factors. In this paper, the influence of high-frequency characteristics of the optical module induced by packaging is analyzed in detail, and three different dimensions of the design scheme are proposed. Then three kinds of high-speed optical modules conforming to the application standard have been developed. It is considered that in the future, the packaging technology will be developed in the direction of multi-dimension and multi-form in the large scale, high density and high rate optoelectronic integrated devices.

[Keywords] three-dimension packaging; high-speed directly modulated laser; monolithic integrated electro-absorption modulated laser; multi-wavelength laser